Lepton XDS Dual-Camera Module Integrates 160x120 Thermal Imager with 5MP RGB Camera - CNX Software

Lepton XDS Dual-Camera Module Integrates 160×120 Thermal Imager with 5MP RGB Camera – CNX Software

2 Min Read

The Teledyne FLIR Lepton XDS dual-camera module integrates a 160 × 120 Lepton 3.5 thermal camera with a 5 MP visible camera. Its SWaP-optimized design makes it perfect for mobile devices, compact electronics, smart buildings, fire detection, occupancy analytics, and equipment condition monitoring.

The Lepton XDS module is ITAR-free, reducing development risks and enabling quicker global market integration.

Lepton XDS specifications:

  • EO Camera
    • Optics – EFL 1.57 mm, 98.2° HFOV, F/1/2.2
    • Sensor – 2592 x 1944 pixels (5 MP), 1.4 µm pitch
    • Video – 640×480 @ 30Hz
  • IR Camera
    • Optics – 57° HFOV, f/1.1
    • Video – 8.7 Hz
  • Thermal Imaging Detector
    • Lepton 3.5 160 x 120 pixels, 12 µm pitch
    • Thermal Sensitivity – 50 mK (0.050 °C)
    • Temperature Accuracy
      • High Gain: Greater of ±5°C or 5%
      • Low Gain: Greater of ±10°C or 10%
  • Power Consumption – 1.6 W Operating, 1.9 W Shutter Event, 500 mW Standby
  • Dimensions – 29 x 26.7 x 8.8 mm
  • Weight – 5.6 grams
  • Temperature Range – Operating: 0°C to +60°C; Non-operating: -40°C to +70°C
  • EMI – FCC: 47 CFR FCC Part 15, Subpart B, Class B
  • ECCN code – 6A003.b.4.b; ITAR-free

The module features Prism ISP image-processing software with FLIR MSX (Multi-Spectral Dynamic Imaging) and VividIR, enhancing thermal images with visible light details and increased sharpness. It supports thermographic tools for ROI, spot meters, isotherms, adjustable color palettes, and measurement overlays.

The Lepton XDS module can save images in RJPG format, with post-processing possible in FLIR Thermal Studio.

The Lepton XDS Development Board Kit facilitates software development, including a board, tripod, and a USB cable, but not the module itself.

The devkit has two USB Type-C ports, a 6-pin GPIO header, a wake-up button, and a micro USB port. It also features a chip with a heatsink likely serving as a USB bridge.

This dual-camera thermal imager type is seen in products like the PitFusion and Xtherm II TS2+, with the Lepton XDS being notably compact and lightweight.

The Lepton XDS module is priced at $239 (MSRP) and is available through distributors. More information can be found on the product page and the press release. Demonstrations will be available at the Mobile World Congress.

Thanks to TLS for the tip.

Support CNX Software via cryptocurrencies, Patreon, or through purchases on Amazon or Aliexpress. We use affiliate links to earn commissions on purchases.

You might also like