Toradex OSM and Lino SoMs: 30×30mm NXP i.MX 93/i.MX 91 Modules with Solder-Down or B2B Connector Designs - CNX Software

Toradex OSM and Lino SoMs: 30×30mm NXP i.MX 93/i.MX 91 Modules with Solder-Down or B2B Connector Designs – CNX Software

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Toradex has introduced two new ultra-compact (30x30mm) System-on-Module (SoM) families: OSM and Lino, utilizing NXP i.MX 91 or i.MX 93 Arm Cortex-A55 SoC for Edge industrial and IoT applications.

The OSM iMX91 and OSM iMX93 models meet the OSM Size-S standard, featuring a 332-ball contact grid for soldering onto the carrier board. The Lino is a proprietary format maintaining the OSM Size-S dimensions but includes two board-to-board (B2B) connectors for greater flexibility in replacement or future upgrades.

Toradex Lino iMX91/iMX93 system-on-module

[Lino IMX93 B2B System on Module image]

Toradex Lino specifications:

SoC (one or the other)
– NXP i.MX 93
– CPU
– 2x Arm Cortex-A55 up to 1.7 GHz
– 2x Arm Cortex-M33 up to 250 MHz
– GPU – PXP 2D GPU with blending/composition, resize, and color space conversion
– NPU – Arm Ethos-U65 NPU @ 1 GHz up to 0.5 TOPS
– Security – EdgeLock Secure Enclave
– NXP i.MX 91
– CPU – Single-core Arm Cortex-A55 up to 1.4 GHz
– GPU – N/A
– NPU – N/A
– Security – EdgeLock Secure Enclave

System Memory – Up to 2 GB LPDDR4 with inline ECC
Storage – Up to 256 GB eMMC flash
Two board-to-board connectors
– Storage – 2x SDIO/SD/MMC
– Display (iMX93 only)
– 4-lane MIPI DSI
– Single-channel LVDS
– Camera (iMX93 only) – 2-lane MIPI CSI-2
– Audio – 1x I2S/PDM
– Ethernet – 2x RGMII (1x with TSN)
– USB – USB 2.0 OTG, USB 2.0 Host
– Low-speed I/Os – 3x I2C, 2x I3C, 2x SPI, 4x UART, 3x PWM, 2x CAN FD, 10x GPIO
– Analog – 4x Analog Input (ADC)

Dimensions – 30 x 30mm
Temperature Range – -40° to +85°C
Shock / Vibration – EN 60068-2-6/50g 20ms
Product Availability – 2040

[Block diagram image]

Toradex supports the company’s Torizon Linux distribution and the Yocto Project by default. FreeRTOS, Zephyr OS, QNX, and Android are available upon request.

For evaluation and initial software development before the custom carrier board is ready, the Lino iMX91/iMX93 evaluation kits are available with an optional 10.1-inch capacitive touch MIPI DSI display (1280×800) and/or a 5MP camera module.

[Lino Evaluation Kit image]

Initially thought to be a mistake, the photo shows a SO-DIMM module. Some edits may be present, but a Verdin SO-DIMM module is actually used as a mini carrier board for the Lino iMX91/iMX93 module.

[Lino on Verdin SO-DIMM module image]

Samples for the Lino iMX91/iMX93 start at $30.65 and $33.35, respectively. Evaluation kit pricing wasn’t found, but for reference, the Ivy Verdin carrier board used in the kits starts at $99.20. More details are available on the Lino modules product page.

OSM iMX91/iMX93 solder-on modules

[OSM iMX93 system on module image]

Toradex OSM iMX91/iMX93 specifications:

SoC – NXP i.MX 93 or i.MX 91
System Memory – Up to 2 GB LPDDR4 with inline ECC
Storage – Up to 256 GB eMMC flash
332 LGA contacts
– Storage – 2x SDIO/SD/MMC
– Display (iMX93 only)
– 4-lane MIPI DSI
– Single-channel LVDS
– Camera (iMX93 only) – 2-lane MIPI CSI-2
– Audio – 1x I2S/PDM
– Ethernet – 2x RGMII (1x with TSN)
– USB – USB 2.0 OTG, USB 2.0 Host
– Low-speed I/Os – 2x I2

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