Apple is set to revamp its chip design for the 2026 iPhones, indicating a notable change in its strategy toward mobile device architecture. This transformation is slated to make its first appearance with the iPhone 18 Pro, 18 Pro Max, and the forthcoming iPhone 18 Fold, showcasing the innovative A20 chip developed using TSMC’s second-generation 2nm process (N2).
A crucial element of this redesign involves the implementation of Wafer-Level Multi-Chip Module (WMCM) packaging for the iPhone processors. WMCM facilitates the integration of multiple components, including the System on Chip (SoC) and DRAM, directly at the wafer level prior to being separated into individual chips. This cutting-edge method connects the dies without requiring an interposer or substrate, thereby improving thermal and signal integrity.
The consequences of this new chip design are considerable. The A20 chip is expected to be not only more compact and power-efficient owing to the N2 process, but its closer alignment with onboard memory is anticipated to enhance performance and lower power usage, especially for demanding applications like AI processing and high-end gaming.
Meanwhile, TSMC is gearing up to launch a specialized WMCM production line, intending to significantly boost capacity by 2027. This development signals a broader trend where cutting-edge technologies, once restricted to data center GPUs and AI accelerators, are increasingly being incorporated into smartphones.
For Apple, this marks a significant leap in chip design, similar to its previous embrace of 3nm technology. The iPhone 18 Fold might act as a proving ground for this next-generation silicon packaging, indicating that Apple is dedicated to advancing the limits of mobile technology.
