
Back in August last year, we wrote about NXPâs IW623 tri-band (2.4GHz, 5GHz, 6GHz) Wi-Fi 6E and Bluetooth LE Audio SoC, but at the time, there was no ready-to-use module based on it. Now, NXP has partnered with Silex Technology to launch the SX-SDMAX6E module, available in a surface-mount LGA package or an M.2 2230 Key-E card. The module supports Bluetooth 5.x connectivity via UART and Wi-Fi via SDIO. It operates from a 3.3V supply with 1.8V support on the LGA version. It has an industrial operating temperature range of -40°C to +85°C and is designed for both high-throughput applications, such as video streaming, and low-power, battery-operated devices in harsh environments. It also supports various antenna options, fast roaming, and long-term lifecycle backing through Silex and NXP. Silex SX-SDMAX6E specifications: Wireless chipset â NXP IW623 tri-band SoC Connectivity Wi-Fi Tri-band Wi-Fi 6E (2.4 GHz, 5 GHz, 6 GHz) IEEE 802.11a/b/g/n/ac/ax […]
The post Silex SX-SDMAX6E tri-band Wi-Fi 6E + Bluetooth LE module features NXP IW623 SoC, comes in M.2 or LGA package appeared first on CNX Software – Embedded Systems News.
