TECNO is set to unveil its modular smartphone concept at the Mobile World Congress 2026. Their “Modular Magnetic Interconnection Technology” is designed to create sleek, modular smartphones with magnetic hardware expansion capabilities.
While this concept is not groundbreaking, given past attempts like Motorola’s Project Ara and Google’s continuation, TECNO’s approach could mark a renewed interest. Currently, the Fairphone offers some modularity for repairability, though it’s limited.
TECNO has developed ten magnetic modules, such as camera options (ACTION CAMERA and TELEPHOTO LENS), a game pad, and an off-grid communication module with mmWave, potentially including LoRa/Meshtastic. Also, a 4.5mm “POWER BANK” module supplements the phone’s battery life. The device features eight modular zones using pogo pins for add-ons.
The “Modular Magnetic Interconnection Technology” presents a scalable platform with potential for AI tools, storage expansion, and lifestyle accessories. The interface remains proprietary, which limits third-party module development, but TECNO hints at future openness.
Two versions of the phone are in progress, differing in aesthetics: the MODA, with a bold, geeky look, and the ATOM, featuring a silver-aluminum finish with red details. Both are 4.9mm thick, keeping the device under 1cm with the POWER BANK module, similar to conventional smartphones.
As this is a concept, TECNO hasn’t released detailed product or pricing information. However, attendees of MWC 2026 can expect to see demonstrations or models.
Source: Liliputing