ADLINK OSM-MTK520 is a 45 x 45mm OSM Size-L system-on-module featuring a MediaTek Genio 520 AIoT processor with a 10 TOPS NPU for Edge AI tasks. It updates the company’s OSM-MTK510 OSM Size-L module equipped with a Genio 510 hexa-core SoC (3.2 TOPS NPU), accommodating up to 32GB eMMC flash and 8GB LPDDR4, to a Genio 520 octa-core SoC (10 TOPS NPU), supporting up to 256GB or 512GB UFS 3.1 storage, and up to 16GB LPDDR5 memory. The changes also include modified I/Os with an additional USB OTG interface, DisplayPort instead of HDMI, an extra MIPI CSI camera interface, fewer I2C interfaces, and more GPIOs.
Specifications of the ADLINK OSM-MTK520:
– SoC: MediaTek Genio 520 (MT8371)
– CPU: Octa-core with 2x Cortex-A78 cores @ up to 2.2 GHz and 4x Cortex-A55 cores @ up to 2.0 GHz
– GPU: Arm Mali-G57 MC2 GPU up to 880 MHz
– VPU: H.265/HEVC or H.264 encoding up to 4Kp30 and decoding up to 4Kp60
– AI accelerator: 10 TOPS NPU
– System Memory: 2GB, 4GB, 8GB, or 16GB LPDDR5
– Storage: 64GB, 128GB, 256GB, or 512GB UFS 3.1 flash, optional SPI NOR flash
– 662 contacts:
– Storage: 2x SDIO (4-bit), compatible with SD/SDIO standard, up to version 3.0
– Display Interfaces: 4-lane DisplayPort 1.4, 4-lane MIPI DSI (multiplexed with LVDS), 4-lane eDP 1.4, single-channel LVDS (multiplexed with MIPI DSI)
– Camera: 2x 4-lane MIPI CSI, compatible with the MIPI Alliance Interface Specification v2.1, up to 4 data lanes, with a maximum data rate of 2.5 Gbps per lane
– Audio: 2x I2S interfaces, I2S audio codec (located on the carrier)
– Networking: Gigabit Ethernet with TSN
– USB: 1x USB 3.1, 2x USB 2.0, 1x USB 2.0 OTG
– PCIe: PCIe Gen2
– Low-speed I/Os: 4x UART interfaces (UART A has Tx/Rx/CTS/RTS), 3x SPI interfaces, 2x I2C interfaces, 22x GPIO with interrupts
– Security (part of SoC): Arm TrustZone, Secure Boot (RSA4096), Crypto Engine, True random number generation RNG
– Supply Voltage: 5V DC +/-5%
– Power Consumption: Under 5W
– Dimensions: 45×45 mm (SGET OSM Size-L form factor)
– Temperature Range: Standard 0°C to +60°C, Rugged -40°C to +85°C (optional)
– Humidity: 5-90% RH operating, non-condensing; 5-95% RH storage (and operating with conformal coating)
– Shock and Vibration: IEC 60068-2-64 and IEC-60068-2-27, MIL-STD-202F, Method 213B, Table 213-I, Condition A and Method 214A, Table 214-I, Condition D
– HALT: Thermal Stress, Vibration Stress, Thermal Shock, and Combined Test
ADLINK provides a Yocto Linux BSP for the module, with the potential for Android and/or Ubuntu support upon request. Though no specific development kit for the MediaTek Genio 520 OSM module is available, the company offers the I-Pi OSM 510 Development Kit, including the previous OSM-MTK510 module with the OSM-EB4 carrier board, which may be used with the OSM-MTK520 with few adjustments.
Currently, two SKUs are available for ADLINK’s module: OSM-MTK520-4G-64G-CT and OSM-MTK520-4G-64G-ER. They feature an octa-core Genio 520 SoC, 4 GB LPDDR5, and 64 GB UFS, with the former being standard and the latter